Published in: Holistic Approach Environ. 5(2015) 1, pp. 42 – 48
Paper reference number: HAE-71
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THE INFLUENCE OF GRAVITY TO REMOVE WASTE HEAT OF POWER ELECTRONIC COMPONENTS USING LHP
Martin Smitka*, Patrik Nemec*, Zuzana Kolková*, Milan Malcho*
* Faculty of Mechanical Engineering, University of Žilina, Slovakia
Given the rapid progress in the electronics industry, the thermal management of electronics components becomes an important and serious issue. Natural and forced cooling for heat sink are often deficient. One possibility of heat dissipation for high heat flux is using loop heat pipe. The loop heat pipe (LHP) is a two-phase device with extremely high effective thermal conductivity that utilizes the thermodynamic pressure difference to circulate fluid. It was invented in Russia in the early 1980’s. This work deals with the design of LHP for cooling of Insulated gate bipolar transistor and impact of tilt angle of LHP on temperature of transistor. The maximum temperature of transistor is 100 °C. LHP is made of copper pipe. Working fluid is distilled water.
Keywords: loop heat pipe, cooling, electronic component, tilt angle